In the competitive field of electronics manufacturing, skilled experts are scarce. Their valuable time shouldn’t be spent on repetitive, standard tasks. Instead, automation can handle these routine processes, allowing seasoned Through-Hole Technology (THT) soldering experts to focus on critical challenges. Introducing the SOLDER COPILOT—an innovative tool that automates soldering parameter recommendations by individually considering the thermal requirements of THT solder joints.
Benefits of Using SOLDER COPILOT:
- Save Time: Streamline standard processes to increase efficiency.
- Reduce Expert Workload: Allow experts to concentrate on complex soldering issues.
- Minimize Thermal Load: Prevent excessive heating and potential damage to PCBs.
Case Study: Automating Standard Soldering Tasks with SOLDER COPILOT
AMPERIAL is an innovative start up from Nuremberg, developing smart window technologies to improve building efficiency. Developing a novel electrochromic product, a device driver with small footprint is critical – with the capability to supply necessary power to the smart window unit.
PCB Description
- PCB Thickness: 1 mm
- Number of Layers: 4
Given the description of the layer stack, this is likely a standard task without unexpected challenges.
Developing the Soldering Process with SOLDER COPILOT
1. Determining the Preheat Temperature
The applied ROL0 Flux requires a preheat and activation temperature between 90°C and 130°C. We chose to preheat the PCB to a component side temperature of 100°C.
2. Selecting the Nozzle Size
The long pins (over 3 mm) and a large pin diameter (4 mm) necessitated selecting a nozzle with an inner diameter of 6 mm. This size ensures adequate coverage and optimal solder flow.
3. Setting the Solder Temperature
We opted for a solder temperature of 280°C, a typical yet moderate setting for solder baths. This balances efficient soldering with minimal thermal stress on the PCB.
4. Calculating Solder Contact Time
Using SOLDER COPILOT, we obtained solder contact time recommendations for the two connector solder joints. The software suggested a soldering contact time of 2 seconds for both pins, tailored to their specific thermal requirements (Figure 1).
Implementing the Process Setup
Instead of using the expert know how, the recommendation from the SOLDER COPILOT is used. The following parameters are used accordingly with the parameters from the recommendation above. Instead of iteratively trying out different sets of parameters to achieve the required soldering quality, we input the recommended parameters into the machine’s process software:
- Preheat Temperature: 100°C
- Solder Temperature: 280°C
- Outer Nozzle Diameter: 10 mm
- Inner Nozzle Diameter: 6 mm
Results: Achieving First-Shot Success
Optical Inspection
After soldering, we conducted an optical inspection of the solder joints in Figure 3.
- The component side showed correct placement.
- The solder side displayed a well-formed meniscus, indicating proper solder flow and adhesion.
X-Ray Verification
To confirm vertical solder hole fill, we performed an X-ray inspection as shown in Figure 4.
- The x-ray images provided clear evidence that the thermal demands of both solder joints were met.
- The solder hole fill was complete, demonstrating the effectiveness of the recommended parameters.
Conclusion
This success story demonstrates how automation, specifically using SOLDER COPILOT, can significantly reduce the workload of skilled THT soldering experts by efficiently handling standard, repetitive tasks. By automating soldering parameter recommendations based on individual thermal requirements, experts can:
- Save Valuable Time: Focus on critical and complex soldering issues rather than routine tasks.
- Enhance Productivity: Achieve first-time-right results, reducing the need for rework.
- Improve Quality: Optimize soldering parameters to prevent excessive thermal load on PCBs, enhancing product reliability.
Embrace Automation with SOLDER COPILOT
In an industry where expertise is invaluable, automating standard soldering processes not only boosts efficiency but also allows your skilled workforce to tackle challenges that truly require their attention. SOLDER COPILOT provides a smart, reliable way to streamline your THT soldering operations.
Ready to optimize your soldering processes and reduce expert workload?
Contact us, to discover how SOLDER COPILOT can transform your workflow and maximize the potential of your expert team.
By automating repetitive tasks with SOLDER COPILOT, you’re not just saving time—you’re investing in the quality and efficiency of your entire production process. Let your experts focus where they are needed most, and let automation handle the rest.