Detect Risks Early – Save Costs and Development Time with the Solder Copilot
Scheidt & Bachmann is pursuing more efficient product development...
DfM Consulting – Beyond the Rules
Prevent soldering defects before the first prototype with our digital twin-based approach.
Design and DfM Consulting for Through-Hole-Technology (THT)
PCB designers know the challenge
The Problem
Even with perfect DfM rule compliance, your THT assemblies still fail at selective/wave soldering. Why?
Standard checks miss the soldering process physics, that determine actual solderability.
The result: late surprises, rework, and schedule slips that cost nerves and a lot of money.
Our Solution – Solder Copilot
A digital twin of the THT soldering process makes exactly that possible.
Our digital twin highlights risk joints so the root cause of future manufacturing risks can be improved in the design phase, before fixes become expensive.
The value: actionable solderability evaluation on joint-level:
- Energy Label for every joint with required wetting time predictions
- Joint-level THT solderability risk scoring (with red/amber/green)
- Physics-based predictions: required wetting time in seconds
- Hands-On suggestions for design fixes
- Better decicion making on a solid
Conventional DfM rules consider these factors only superficially, usually as simple thresholds (clearances, minimum hole diameters). In practice, the interaction between assembly design and soldering process determines true solderability.
Green joints
Well solderable joint design,
robust process window < 5 s
Yellow joints
Elevated soldering challenge,
iterative process development needed process window 5–7 s
Red joints
elevated soldering challenge, iterative process development needed process window 5–7 s
- With the physics-based approach of the Solder Copilot's technology, subjective, manual assessments are complemented by quantified risk evaluation.
- Critical THT joints are identified before layout freeze and prototype ordering—so issues can be fixed before they become expensive.
The Outcome:
- Valuable insights into manufacturing risks,
- Well-founded design decisions,
- Fewer prototype loops,
- Faster time-to-market,
- Higher manufacturing quality.
WHY CHOOSE US
Years of THT expertise casted into software and simulation based, advanced THT DfM checks.
When should you consider an advanced THT DfM analysis?
⦁ Thick PCBs (> 1.6 mm) with many copper layers (> 4 layers)
⦁ Heavy copper (> 35 µm)
⦁ High-power components (electrolytic capacitors, shunts, transformers)
⦁ Use of solder pallets (masks) for wave and selective-wave soldering on densely populated assemblies
Case Study
Explore our insights on THT soldering, manufacturing optimization, and Design for Manufacturing (DFM). From productivity tips to the latest in Digital Twin technology, our blog provides valuable knowledge to help you enhance quality, reduce costs, and stay ahead in the industry.
What People Say About Our Solutions
See how others saved time and money from the solderability risk assessment Case Study
CEO Löhnert Elektronik GmbH
"We have defined the THT-DfM check by Solder Copilot as the new state of the art, which will be carried out from now on for critical new developments. Instead of waiting weeks for material for sample production, we receive feedback on the solderability of the design in a fraction of the time and can discuss the results with the development team.”
Designation
"Using Solder-Copilot software, we reliably identified THT soldering issues in one of our projects and implemented targeted solutions. Solder-Copilot provides invaluable insights into the solderability of THT solder joints. Conducting the solderability analysis at the project's outset would have saved us significant time and money."