THT soldering quality is sensitive to solder joint design. Therefore, traditional DfM rules frequently fail. Siemens validates how a Digital Process Twin can revolutionize THT soldering — turning months of prototyping into minutes of simulation.
Scheidt & Bachmann is pursuing more efficient product development to enable faster market entry with reduced realization costs. Supporting this
Detect Risks Early – Save Costs and Development Time with the Solder Copilot Read More »
Why Design Rules Are Not Enough: The Crucial Role of Simulation-Based DfM in THT Soldering in high power and high
Detect critical THT solder joints immediately Read More »
In the realm of Through-Hole Technology (THT) soldering, precision and efficiency are paramount. Manufacturers are constantly seeking ways to streamline
Enhancing THT Soldering Efficiency with Digital Twin Technology Read More »
