Stop Trial and Error NPI
Digital Twin Based THT Process Optimization
Cut iterations upto 80% with our digital twin-based approach.
High-mix EMS environment demand new THT jobs every day, each requiring:
- Optimized programs
- Maximum THT hole fill
- Quick process development
- Short cycle time with few samples
Without visibility into the PCB’s solderability, you’re tuning in the dark.
The result: 5+ hour setups, scrap, and pressured deadlines.
Our Solution – Identify difficult solder joints upfront Save hours of trial and error
Joint-level solder time calculation and auto-generation of machine-ready programs.
Our Solder Copilot is the digital twin of the THT process. It highlights risk joints and suggests actionable solder dwell time for your solder temperature, nozzle size and preheat temperature.
Actionable soldering programs optimized on joint-level:
- Improve competitiveness
- Reduce waste of material
- Reduce human exper efford
- Free mchine availability
Conventional DfM rules consider these factors only superficially, usually as simple thresholds (clearances, minimum hole diameters).
In practice, the interaction between assembly design and soldering process determines true solderability.
With the physics-based approach of the Solder Copilot’s technology, time consuming trial and error THT process optimization can be widely skipped.
Every solder joint is calculated individually so the user knows upfront where the issues are and how to setup the soldering process.
Green joints
Well solderable joint design,
robust process window < 5 s
Yellow joints
Elevated soldering challenge,
iterative process development needed process window 5–7 s
Red joints
elevated soldering challenge, iterative process development needed process window 7 s <
How the Digital Twin Works
- 1. Inputs — Gerbers (incl. drills), stack-up & copper weights
- 2. Digital Twin analysis — simulate process szenarios; flag risk joints; compute robust parameter windows
- 3. Export solder program
Your benefits:
- Valuable insights into manufacturing risks
- Fewer prototype loops
- Higher manufacturing quality.
- Every solder joint receives the dwell time it actually needs based on the calculation
Case Study
Explore our insights on THT soldering, manufacturing optimization, and Design for Manufacturing (DFM). From productivity tips to the latest in Digital Twin technology, our blog provides valuable knowledge to help you enhance quality, reduce costs, and stay ahead in the industry.
WHY CHOOSE US
Save hours of trial and error
When is Digital twin THT process optimization beneficial to you?
- Thick PCBs (> 1.6 mm) with many copper layers (> 4 layers)
- Heavy copper (> 35 µm)
- High-power components (electrolytic capacitors, shunts, transformers)
- Use of solder pallets (masks) for wave and selective-wave soldering on densely populated assemblies
What People Say About Our Solutions
See how others saved time and money from the solderability risk assessment Case Study
CEO Löhnert Elektronik GmbH
"We have defined the THT-DfM check by Solder Copilot as the new state of the art, which will be carried out from now on for critical new developments. Instead of waiting weeks for material for sample production, we receive feedback on the solderability of the design in a fraction of the time and can discuss the results with the development team.”
Head of circuit board assembly Scheidt & Bachmann GmbH
"Using Solder-Copilot software, we reliably identified THT soldering issues in one of our projects and implemented targeted solutions. Solder-Copilot provides invaluable insights into the solderability of THT solder joints. Conducting the solderability analysis at the project's outset would have saved us significant time and money."