What People Say About Our Solutions
See how others saved time and money from the solderability risk assessment Case Study
Solderability driven pallet design - Right first time
Industry-leading soldering pallets tailored to PCB solderability
Soldering pallets can make or break your THT soldering process.
A solder masks tailored to PCB solderability makes the difference.
The result: late surprises, rework, and schedule slips that cost nerves and a lot of money.
"With solutions such as Solder Copilot, DEEPTRONICS is able to identify risks early on in the development phase, significantly reduce prototyping costs, and make production processes robust and efficient. This not only saves time, but also significantly improves product quality."
Solderability driven pallet design: Calculate, don’t iterate
Product specific soldering masks, tailored to PCB solderability
Based on this information the solder pallet can be tailored to thermal requirements of the PCB, soldering process and quality needs.
Our digital twin highlights risk joints so the root cause of future manufacturing risks can be improved in the design phase, before fixes become expensive.
World class soldering pallet design @RÖSNICK
Solderability driven Pallet Design in 5 Steps:
- 1. Solder joint level risk assessment based on PCB Design – Gerbers (incl. drills), stack-up & copper weights
- 2. Design Review with customer
- 3. Optimization of the soldering pallet design
- 4. Solder joint level tailored solder pallet design
- 5. Improved process quality and robustness at lower soldering risks
With the Solder Copilot’s digital twin technology, subjective, manual assessments are complemented by quantified risk evaluation. Critical THT joints are identified before layout freeze and prototype ordering—so issues can be fixed before they become expensive.
"As Managing Director of RÖSNICK, I am extremely pleased about the collaboration with DEEPTRONICS GmbH. Their expertise in the field of THT process optimization, digital twins for soldering processes, and DfM consulting is invaluable to our mutual customers. For our mutual customers, this means optimal soldering results when using our solder masks. Together with DEEPTRONICS, we are able to design our solder masks even better based on customer requirements, thereby reducing rework and saving costs. This makes DEEPTRONICS an ideal partner for RÖSNICK. Together, we create added value for our customers."
Customer Success
"We have defined the THT-DfM check by Solder Copilot as the new state of the art, which will be carried out from now on for critical new developments. Instead of waiting weeks for material for sample production, we receive feedback on the solderability of the design in a fraction of the time and can discuss the results with the development team.”
When should you consider an advanced THT DfM analysis?
- Thick PCBs (> 1.6 mm) with many copper layers (> 4 layers)
- Heavy copper (> 35 µm)
- High-power components (electrolytic capacitors, shunts, transformers)
- Use of solder pallets (masks) for wave and selective-wave soldering on densely populated assemblies
WHY CHOOSE US
Years of THT expertise casted into software and simulation based, advanced THT DfM checks.
Head of circuit board assembly Scheidt & Bachmann GmbH
"With solutions such as Solder Copilot, DEEPTRONICS is able to identify risks early on in the development phase, significantly reduce prototyping costs, and make production processes robust and efficient. This not only saves time, but also significantly improves product quality."
CEO, RÖSNICK GmbH
"The results of the DfM analysis performed by Solder Copilot are very helpful to us in the design of solder masks. Instead of only considering the geometry of the assembly when designing the nest, we can now identify critical solder joints separately and respond to them specifically."
Head of pallet design, RÖSNICK GmbH
"We have defined the THT-DfM check by Solder Copilot as the new state of the art, which will be carried out from now on for critical new developments. Instead of waiting weeks for material for sample production, we receive feedback on the solderability of the design in a fraction of the time and can discuss the results with the development team.”